湖州努特表面处理科技有限公司 湖州努特表面处理科技有限公司

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Continuous coil-to-coil electroplatingCeramic plating, ceramic circuit boardElectrochemical polishing, passivation, nickel-chromium plating, electroless nicLow-temperature black chromiumhard chromium surface treatmentZinc plating productsAluminum oxidation and aluminum surface treatmentSurface treatment for auto partsElectroless nickel platinggold platingCopper, nickel and chromium platingElectrosilvering

Ceramic plating, ceramic circuit board

The main electroplating is to plate the surface of materials (such as semiconductor and metal) with nickel, tin, gold and alloy. Electroless plating and physical plating are respectively adopted. The plating layer film thickness may be accurately controlled. High quality is highly recognized in the industry.

Detail

The main electroplating is to plate the surface of materials (such as semiconductor and metal) with nickel, tin, gold and alloy. Electroless plating and physical plating are respectively adopted. The plating layer film thickness may be accurately controlled. High quality is highly recognized in the industry.
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Semiconducting crystal

Main performance parameters


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